Manufacture # Team | Model # TLZGD416G3600HC18JDC01
Designed for complete protection and enhanced heat dissipation, the heat spreader is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, the electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, the superconductive thermal adhesive can maintain gaming memory within operating temperatures.
Features:
- Simple design to perfectly protect the cooling module
- High thermal conductive adhesive
- Supports Intel & AMD motherboards
- Selected high-quality IC
- Supports XMP2.0
- Energy saving with ultra-low working voltage
Overview:
- Capacity: 16GB (2x8GB)
- Frequency: 3600MHz
- Latency: CL18
- BIOS/Performance Profile: Intel XMP 2.0
- Data Transfer Bandwidth: 28800 MB/s
- Voltage: 1.35V
Manufacturer Warranty: Lifetime Limited Warranty