Thermal Conductivity: > 1.93 W/m-K at 25 °C, Thermal Resistance: < 0.120 °C-in2/W at 25 °C, Bleed: < 0.05% at 150°C/24 Hours, Evaporation: < 0.001% at 150°C/24 Hours, Specific Gravity: > 1.7 at 25 °C, Color: Silver, Materials: Silicone Compounds 50%; Carbon Compounds 30%; Metal Oxide Compounds 20%. This thermal paste works with a heat sink to improve heat dissipation from integrated circuits (ICs), like CPUs, GPUs and other computer chips. The thermal paste features CE and RoHS certifications so you can rest assured it's safe for its intended use.